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本月摩台結算日...........Intel替台積電預備了利空!minervach889

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相關個股:台積電(2330)、新產(2850)

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intel季報弱勢析
1. 主要ccg事業群的hp及dell,尤其hp已揭露受疫情較嚴重影響,且兩者本身有美國製造產能,在美國最缺櫃、最塞港下,intel受到衝擊會更大
2. 季報新聞稿中,Ice Lake Xeons是最不如預期的產品,反映arm及amd侵略性確實存在
3. Dcg事業群部分,成長不如預期與ccg有異曲同工之妙,並為市場下殺的主要兩大理由之一
4. 至於,毛利率看弱部分,可從arizona進度超前3個月,相對製造費用也會開始認列
對台積上周五下跌的原因,
1. intel將大張旗鼓於27日再辦ifs 2.0虛擬論壇...新聞稿明言製程進展順利與較3月時更樂觀
2. 本次季報雖未公佈ifs營收,但挑明已出貨,並認為未來會成長營收支柱,從附圖看,dcg與ccg定然很快是1:1的營收比例,若再加上ifs的動能增長,未來三分intel天下應是目標才是
3. 新聞稿已指出google及amazon及高通皆已為其客戶,搭配阿里及oppo等近期下單予台積新聞與白宮正承受”對華為及中芯放行太多”且trumph的社交媒體已對明年美國期中選舉掀起戰火…….阿里等”雲晶片”國安問題性將恐被放大
4. Intel毛利率看弱,另一主因在與台積一樣資本支出過大的疑慮,但此部分有a.intel本就處在高成本生產環境,台積正在啟動b.intel的資本支出多是在ifs事業,以其千億美金的支出反推,將來ifs自然一定得要是核心部門,自然對台積不利……………備註就是,台積今年工安事件是史上少有的頻繁,且缺電事件與環評事件,皆讓其未來建廠速度能否像intel一樣傳捷報,也是市場關注焦點
最後,美國投銀分析,點出另個市場忽略的因子,intel是在沒有新產品加持下的業績,隱含其財報其實不能弱勢看待……….再者,台積有了中國雲訂單,在明年期中選舉戰火下,台積要取得美國補助難度又墊高
以下為intel的新聞稿與ifs有關的原文


Announced Amazon as first customer to use Intel Foundry Services’ packaging services, and a partnership with Qualcomm to use the future Intel 20A process technology.
Broke ground on two new leading-edge chip factories at Intel’s Ocotillo campus in Chandler, Arizona, three months ahead of schedule.

As part of its IDM 2.0 strategy, Intel will be making a series of product and technology announcements at its upcoming Innovation virtual event on October 27-28, 2021. The conference is designed for developers, industry insiders, and will feature technical sessions on Intel's AI, 5G, edge, cloud connectivity, and client applications. Join the public webcast and follow the news at newsroom.intel.com at 9 a.m. PDT on Wednesday, October 27th, 2021.

Our focus on execution continued as we delivered on our initial IDM 2.0 commitments. We broke ground on new fabs, shared our accelerated path to regain process performance leadership, and made our most dramatic architecture announcements in a decade. We also announced major customer wins across every part of our business, including in the Datacenter with AWS and Google, new EVO designs in client, and exciting Mobileye partnerships with ZEEKR and Sixt SE

Since March, we have:  • shipped our first IFS packaging units for revenue • engaged with well over 100 potential customers, including several large customers who are working with us on our leading-edge Intel 18A, and  4 • We have multiple customers planning test chips on Intel 16 that will be in our factories early next year. We also had a significant win with the U.S. Government, which selected Intel to provide commercial foundry services in the first phase of its RAMP-C program. We are proud of this achievement and the confidence the US government has in us to deliver them a trusted foundry capability. 

In July, at our Intel Accelerated event, the team and I shared the most detailed roadmap we’ve ever provided for process and packaging technologies – a roadmap that brings us to process performance parity in 2024 and clear leadership in 2025. I am happy to share that Intel 7, Intel 4, Intel 3, Intel 20A, and Intel 18A are all on or ahead of the timelines we set out in July.

https://www.intc.com/news-events/press-releases/detail/1505/intel-reports-third-quarter-2021-financial-results


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